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How to Ensure the Stability of the Wafer Dicing Process?

Case｜How to Ensure the Stability of the Wafer Dicing Process？

To achieve higher wafer yield rates, it is essential not only to control environmental factors but also to ensure that processing equipment can operate stably. Since wafer dicing machines significantly impact chip quality, how can we ensure the stability of the dicing process？

Wafer Dicing Machine

To achieve higher wafer yield rates, it is essential not only to control environmental factors but also to ensure that processing equipment can operate stably. Since wafer dicing machines significantly impact chip quality, how can we ensure the stability of the dicing process？

Operating Principle of Wafer Dicing Machine
The main components of a dicing machine include the spindle, cutting blade, and wafer chuck (holding table). During the operation, the machine utilizes various blade materials such as metal, ceramic, resin, and electroforming, along with a high-speed spindle motor and precise positioning system to perform the cutting task.

Difference Between Soft and Hard Blades
Soft blades are classified by different bonding agents, such as electroformed blades, resin-based blades, metal blades, and ceramic blades. They are lower in cost but require precision in use. The blade diameter can be replaced as it wears down, and pre-sharpening is needed to meet cutting sharpness requirements.

Hard blades, on the other hand, are typically formed by electroforming (integrated with an aluminum alloy blade holder), designed for one-time use at a higher cost.

Solution and Monitoring Overview

IMS-DS Wafer Dicing Machine Quality Management Analyzer
Measures the working speed of the dicing machine spindle and different blades. By analyzing the measurement results, we can evaluate the working condition between the blade and spindle, ensuring equipment health and enabling proactive maintenance before issues occur.